Semiconductor CEOs offer their outlook for the industry

Semiconductor CEOs offer their outlook for the industry | Sony's chip unit plans subscription-based services | IC Insights: Taiwan still leads in wafer capacity

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June 25, 2020

News for and about the microelectronics industry

Today's Tech Buzz

Semiconductor CEOs offer their outlook for the industry

(Pixabay)

Six top executives share their perspectives on what's happening in the semiconductor industry and what may occur in the near future in this roundtable interview. Arm CEO Simon Segars says, "We see lots and lots of people really leaning into what do they need to have technology-wise to succeed when we come out of this crisis, and doing the work now to set themselves up for success."

Full Story: Semiconductor Engineering (6/25)

ICs, Memory & More

Sony's chip unit plans subscription-based services

Sony's headquarters in Japan (Kazuhiro Nogi/AFP via Getty Images)

Sony's semiconductor business is working up a series of subscription-based services, such as extended support and software, to bring in additional revenue. "In order to be successful in the solution business, we need to step outside that product-oriented approach," says Hideki Somemiya of Sony.

Full Story: Bloomberg (tiered subscription model) (6/24)

IC Insights: Taiwan still leads in wafer capacity
Electronics Weekly (UK) (6/25)

GlobalFoundries looks to add US fab lines
Reuters (6/24)

Viewpoint: Will Apple be buying Arm one day?
Electronics Weekly (UK) (6/24)

Going Green

Zaram, KEIT craft an ultra-low-power 5G chip

Zaram Technology worked with the Korea Evaluation Institute of Industrial Technology to design an ultra-low-power microchip for 5G cellular communications. The company has put its ZARAM XGSPON STICK symmetric passive optical network stick-type terminal into volume production.

Full Story: BusinessKorea magazine online (6/25)

How IT can help drive employee engagement

Sponsored content from ADP

Leveling up your contingent workforce

If you are using a greater number of independent workers during this time, you may be facing some unique challenges. Learn more about optimizing your contingent workforce, keeping them engaged and productive, and getting the most out of your organization's relationship with these valuable workers. Read the article.

What CIOs need to know about HR

ADP executives Sreeni Kutam and Sugi Venkatesh say greater collaboration between IT and HR can help create a better experience for employees throughout your organization. Read the article.

Semiconductors in Action

Renesas debuts a magnet-free inductive position sensor

Renesas Electronics brought out the IPS2200 inductive position sensor. The magnet-free component is meant as an absolute position sensor for medical, industrial and robotics applications.

Full Story: New Electronics (6/25)

Infineon works with Blumio on blood pressure sensor

The Silicon Valley Innovation Center of Infineon Technologies is partnering with Blumio, a cardiovascular monitoring specialist, to come up with a wearable, radar-based blood pressure sensor. The product, due out next year, will use Infineon's XENSIV radar chipset.

Full Story: Electronics Weekly (UK) (6/25)

Testing & Standards

Verification faces issues from over-design, under-design

Over-design and under-design are equally challenging when it comes to verifying a complex chip design, this analysis notes. Tim Kogel of Synopsys says, "For deeply embedded applications with deterministic workload, like a smart security camera, the traffic streams can be handled explicitly, such as by prefetching data for known traffic patterns with DMAs and memory buffers."

Full Story: Semiconductor Engineering (6/25)

JEDEC News

JEDEC publishes several new and updated standards:

JESD79-4C: DDR4 SDRAM Standard
JESD209-4C: Low Power Double Data Rate 4 (LPDDR4)
JESD246A: Customer Notification Process for Disasters
JESD22-A105D: Power and Temperature Cycling
JESD22-B114B: Mark Legibility
JEP180: Guideline for Switching Reliability Evaluation
Procedures for Gallium Nitride Power Conversion Devices
Updates to JEP95: JEDEC Registered and Standard Outlines for Solid State and Related Products

Visit the JEDEC website for more information and download.