Qualcomm's Amon touts 5G tech's potential

Qualcomm's Amon touts 5G tech's potential | China's chip industry looks to 5G, EV, AIoT uses | Intel sees chips with nanowires and nanoribbons by 2025

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June 23, 2020

News for and about the microelectronics industry

Today's Tech Buzz

Qualcomm's Amon touts 5G tech's potential

Amon (Mario Tama/Getty Images)

Cristiano Amon, president of Qualcomm, talks about what 5G cellular communications technology will mean for a variety of applications in this interview. "It allows everything to be connected -- phones, PCs, and lots of machines," he says.

Full Story: Forbes (6/22)

ICs, Memory & More

China's chip industry looks to 5G, EV, AIoT uses

Colley Hwang, president of DigiTimes, says China's domestic semiconductor industry will benefit from the implementation of 5G, artificial intelligence/internet of things and electric vehicles. China will play a critical role in the EV market, since six of the 10 leading suppliers of EV batteries are based in China, he notes.

Full Story: DigiTimes (6/23)

Intel sees chips with nanowires and nanoribbons by 2025
AnandTech (6/22)

GF plans Fab 8 expansion with property purchase option
Electronics Weekly (UK) (6/23)

4 firms join Silicon Catalyst incubator program
New Electronics (6/23)

Going Green

Maxim debuts Arm Cortex-M4F MCU for a variety of uses

Maxim Integrated brought out a low-power microcontroller based on the Arm Cortex-M4F core design. The chip is meant for applications in health care, industrial systems and the internet of things.

Full Story: New Electronics (6/23)

Semiconductors in Action

Japan has the fastest supercomputer in the world

The biannual Top500 survey of the world's supercomputers reveals the fastest system now is Fugaku in Kobe, Japan, built by Fujitsu and Riken. The supercomputing system is built around Fujitsu's 48-core A64FX system-on-a-chip device, designed with Arm cores.

Full Story: The Verge (6/23)

Leti's CoolCube process can withstand 500 degrees C

CEA-Leti reports development of the CoolCube process, fully-depleted silicon-on-insulator complementary metal-oxide-semiconductor technology that can produce chips capable of withstanding 500 degrees C during microchip manufacturing. The process could be used in making p-type MOS logic devices, according to the research organization, which collaborated with Samsung Electronics.

Full Story: Electronics Weekly (UK) (6/22)

Testing & Standards

Analysis: Will PAM-8 follow PAM-4 in physical signaling?

PAM-4 is a key standard in high-speed physical signaling today, yet there is conjecture whether there will be a movement toward a PAM-8 standard, Bryon Moyer writes. Saman Sadr of Rambus says, "PAM-8 is not right now being that actively considered," noting that "the amplitude that we can reliably transmit is about 1V peak-to-peak."

Full Story: Semiconductor Engineering (6/23)

JEDEC News

JEDEC welcomes new member companies to the Association

JEDEC is the global leader in developing standards for the microelectronics industry, bringing together thousands of member company volunteers over 100 technical committees and task groups to meet the needs of every segment of the industry. JEDEC is pleased to extend a warm welcome to new member companies 3D Plus, Cyntec Co., ETRI, Global Mixed-mode Technology Inc., Solid State Storage Technology Corporation and Tachyum, Inc. Interested in JEDEC membership for your company? Find out more and join today.